Date

2024/01/24  ~  2024/01/26
0Last
Day
  • Location

    Asia/ Japan/ Tokyo

  • Contact Person

    Maureen Chen

  • 台灣區電機電子工業同業公會

Semiconductor, Electronics, Electrical Engineering | Engineering, Manufacturing & Processing, Smart Manufacturing | Web 3.0, Telecommunications | Machine Tools, Metalworking, Automation

IC & Sensor Packaging Technology EXPO 2024

Asia’s Leading Event for IC Final Manufacturing gathering Advanced Equipment, Materials and Services

Feel free to enter your contact information, and we will provide you with comprehensive information on shows around the world!

About the Show, Floor Plan, Report on Previous Show, Exhibitors at Previous Show, Participation Fees, Subsidies, and more