Date

2024/01/24  ~  2024/01/26
0Last
Day
  • Location

    Asia/ Japan/ Tokyo

  • Contact Person

    Maureen Chen

  • 台灣區電機電子工業同業公會

Semiconductor, Electronics, Electrical Engineering | Engineering, Manufacturing & Processing, Smart Manufacturing | Web 3.0, Telecommunications | Machine Tools, Metalworking, Automation

IC & Sensor Packaging Technology EXPO 2024

Asia’s Leading Event for IC Final Manufacturing gathering Advanced Equipment, Materials and Services