Date

2025/01/22  ~  2025/01/24
24Last
Day
  • Location

    Asia/ Japan/ Tokyo

  • Contact Person

    Ruby Chen

  • 台灣區電機電子工業同業公會

Semiconductor, Electronics, Electrical Engineering | Engineering, Manufacturing & Processing, Smart Manufacturing | Web 3.0, Telecommunications | Machine Tools, Metalworking, Automation

IC & Sensor Packaging Expo 2025

Asia’s Leading Event for IC Final Manufacturing gathering Advanced Equipment, Materials and Services