Location
Asia/ Japan/ Tokyo
Date
2024/01/24
~
2024/01/26
0Last
Day
Day
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Contact Person
Maureen Chen
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台灣區電機電子工業同業公會
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Semiconductor, Electronics, Electrical Engineering | Engineering, Manufacturing & Processing, Smart Manufacturing | Web 3.0, Telecommunications | Machine Tools, Metalworking, Automation
IC ＆ Sensor Packaging Technology EXPO 2024
Asia’s Leading Event for IC Final Manufacturing gathering Advanced Equipment, Materials and Services
