Date

2025/05/14  ~  2025/05/16
144Last
Day
  • Location

    Asia/ Japan/ Osaka

  • Contact Person

    Ruby Chen

Automobiles, Automotive Engineering | Consumer Electronics | Semiconductor, Electronics, Electrical Engineering | Engineering, Manufacturing & Processing, Smart Manufacturing | Machine Tools, Metalworking, Automation

Adhesion & Bonding Expo Osaka 2025

Highly Function Adhesion & Bonding Expo Specialised Show for All Industrial Bonding Technologies!!