Location
Asia/ Japan/ Osaka
Date
2025/05/14
~
2025/05/16
111Last
Day
Day
-
![]()
-
![]()
Contact Person
Ruby Chen
-
![]()
Automobiles, Automotive Engineering | Consumer Electronics | Semiconductor, Electronics, Electrical Engineering | Engineering, Manufacturing & Processing, Smart Manufacturing | Machine Tools, Metalworking, Automation
Adhesion & Bonding Expo Osaka 2025
Highly Function Adhesion ＆ Bonding Expo Specialised Show for All Industrial Bonding Technologies!!
