Location
Asia/ Japan/ Tokyo
Date
2026/01/21
~
2026/01/23
331Last
Day
Day
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Contact Person
Ruby Chen
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Engineering, Manufacturing & Processing, Smart Manufacturing | Machine Tools, Metalworking, Automation | Semiconductor, Electronics, Electrical Engineering | Web 3.0, Telecommunications
IC & Sensor Packaging Expo 2026
Asia’s Leading Event for IC Final Manufacturing gathering Advanced Equipment, Materials and Services
