Date

2024/05/08  ~  2024/05/10
0Last
Day

  • Location

    Asia/ Japan/ Osaka

  • Contact Person

    Maureen Chen

  • 台灣雷射科技應用協會

  • Website

Automobiles, Automotive Engineering | Consumer Electronics | Semiconductor, Electronics, Electrical Engineering | Engineering, Manufacturing & Processing, Smart Manufacturing | Machine Tools, Metalworking, Automation

Adhesion & Bonding Expo Osaka 2024

Highly Function Adhesion ＆ Bonding Expo Specialised Show for All Industrial Bonding Technologies!!

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About the Show, Floor Plan, Report on Previous Show, Exhibitors at Previous Show, Participation Fees, Subsidies, and more