Date

2026/05/13  ~  2026/05/15
339Last
Day

  • Location

    Asia/ Japan/ Osaka

  • Contact Person

    Maureen Chen

  • Website

Automobiles, Automotive Engineering | Consumer Electronics | Engineering, Manufacturing & Processing, Smart Manufacturing | Machine Tools, Metalworking, Automation | Semiconductor, Electronics, Electrical Engineering

Adhesion & Bonding Expo Osaka 2026

Japan's Largest Show for All Industrial Adhesion & Bonding Technologies!

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About the Show, Floor Plan, Report on Previous Show, Exhibitors at Previous Show, Participation Fees, Subsidies, and more